Macrotron Systems has a multi-talented engineering team with extensive experience in the design of Memory modules, PC peripherals and Communication products for in-house assembly and test.

Macrotron has engineering capabilities in the following areas:

  • PCB design
  • Simulation
  • Verification
  • Gerber file generation
  • Prototype build
  • Test
  • Cost optimization
  • Alternate source selection and qualification
  • Design for manufacturability
  • Built in test capability

Areas of Test:
  • Develop load boards for testers
  • IC characterization
    • Parameter schmoo plots
    • Temperature extremes
    • Variable power supply voltages
    • Data analysis
  • Module yield improvement
  • System test time optimization
  • Test equipment
  • Handler equipment
  • Test support equipment
  • Test software
  • Miscellaneous services

Final Test Capabilities:

  • All common memory devices and packages
  • Marking, labeling, and packaging

Macrotron can offer the lowest total cost of engagement through:

  • Engineering expertise
  • Efficient manufacturing
  • Flexibility
  • Proven quality
  • Historically reliable

Maintaining an Engineering team that is knowledgeable with state-of-the-art memories provides a high level of intelligence for Macrotron's specialized assembly and test OEM customers.

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