PCB Depanelizer/Separator

Posted on November 8, 2011 by admin
MSI ID 00037
Serial Number
Model EM-5700N
Manufacturer Elite Automation
Equipment
Description		 The unit can be used to depanelize PWBA using high speed router bits driven through servo drives. The depanelizer has a very high XYZ accuracy (0.01 mmm) and built-in safety features protecting the PWBA to get damaged.
Features Machine Size – 1100 mm (L), 1020 mm (W), 1400 mm (H)
PCB Routing Dimensions – 400 mm (L) x 340 mm (W)
Cutting Speed – Max 60 mm/sec
Spindle Speed – Max 40K RPM
XYZ Tolerance - 0.01 mm
PC Window – Windows based routing software
CCD Vision Camera - High quality CCD vision camera to program routing path.
Easy Operable - Easy operable and better than V-cut & punch machines.
Good for thin PCB - Good for routing notebook or smartphone PCB’s.
Specifications Power 220VAC; 50/60Hz; 2000W; 3-Ph
Weight 850 Kgs
Manufactured
Year
Quantity 1


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IEMME ITALIA Convection Reflow Oven

Posted on April 16, 2011 by admin
MSI ID 00076
Serial Number 0020AF1996
Model IRCON 16
Manufacturer IEMME ITALIA
Equipment
Description		 IRCON 16 oven is heated by forced stream of hot air or nitrogen and I.R. panels. Heating zones are 16 along the 457 mm wide conveyor belt running up to 200 cm/min.
Specifications 80A; 220V; 60Hz; 3-Ph
External Dimensions: 173″ x 48″ x 55″
Manufactured
Year		 1996
Equipment Status Not in Service; Condition Unknown
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Kaeser Air Box AB700 Compressor

Posted on February 23, 2011 by admin
MSI ID 00248
Serial Number 4711221
Model AB700
Manufacturer Kaeser
Specifications Motor Power: 4 KW
Max. Operating Pressure: 10 Bar
Approved Pump speed: 1000 rpm
Tank: 1 1/4 Gallon
Displacement: 24.7 cfm
HP: 5.5
Voltage: 230/460
Amp: 15.6/7.8
Manufactured
Year		 1992
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CO2 Laser Marker

Posted on February 17, 2011 by admin
MSI ID 00020/00021/00022/00065
Serial Number 001/002/003/004
Manufacturer Unique Equipment Company
Model 193
Equipment Description The CO2 Laser Marker is a PC controlled workcell designed to laser mark hysol coated PCB’s. PCB sizes can range from 2.4 inches to 15 inches in width and 4 inches to 18 inches in length. The mark would typically consist of a barcode and alphanumeric characters oriented in any of the four 90 degree orientations. The barcodes are verified after marking by one of the two barcode readers in the system.
Specifications 208VAC; 5 Wire; 60HZ; 30A; 3PH
Lumonics C02 Laser, Laser Measurement System, Motion Controller, Two Barcode Readers
Manufacturing Year 1994
Quantity 4
Status Operational
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Kulicke & Soffa Turbo Automatic Gold Ball Bonder

Posted on February 17, 2011 by admin
MSI ID 00167, 00168, 00169
Serial Number 5994/5976/3008
Manufacturer Kulicke & Soffa Industrial, Inc
Model 1488 L series
Equipment
Description		 K&S 1488 turbo automatic wire bonder is designed for making gold wire interconnections on semiconductor integrated circuit (IC) devices. The machine attaches wire by means of a thermosonic ball bonding process using heat, pressure and ultrasonic energy to fuse each end of the wire to the device.
The machine features an integrated Model 860 PRS Video Lead Locator system and may be equipped with one of serveral different automatic material handling systems, depending on the requirements of the application.
Specs Facility Requirements
Electrical Power: 100, 115, 200, 208, 230 or 240 VAC; 50/60 Hz; 2.2 KVA
Compressed air: 65-100 psi, 2.5 scfm; dry, filtered, unlubricated
Environment
Temperature: 10-35 degree celsius
Humidity: 5-95% RH
Floor space requirements:33″W X 37″D
Weight: 700 lbs.

X-Y table resolution: 0.1 mils(2.5 microns)
X-Y table accuracy: ±0.15 mils (±3.8 microns)
Bonding Speed: 115 milliseconds/wire
Wire Size: 0.7-2.0 mils
Wire Length: 20-250 mils
Wire Type: Gold
Magazine Pitch: 80-540 mils

Software Version: 7-02-4-16
Manufactured Year 1996/1999
Components/
Accessories
K&S 1488 Operational/Maintenace Manual
Quantity 3
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ESEC Micron 2

Posted on February 17, 2011 by admin
MSI ID 00170, 00172
Serial Number 13-259, 14-288
Manufacturer ESEC Industries
Model M2
Equipment/
Description		 The Micron 2 is a high-precision, modular component placement system. It can be adapted to different production tasks such as the placement of SMD and DIE components, flip chips, µBGAs, and special componet types.
The Micron 2 is a highly flexible system. Defferent feeder types, such as a wafer die eject feeder, waffle pack feeder, tray feeder, or gel pack feeder, can be chosen for different component types.
Intelligent tape feeders (PTF-series), are especially appropriate for SMD components. The maximum number of different components which can be simultaneously processed is 64.
The Micron 2 has been developed for different present day and future technologies. Due to the extreme precision of the system (±12µm, 3Sigma), all components upto a size of 0.25 mm x 0.25 mm to 30 mm to 30 mm can be placed. The maximum height of the components that can be processed is 22 mm.
Special tape feeders have been designed for dies and flip chips. These PTE-DE (Die Eject) and PTE-DEF (Die Eject Flip) are available for tape widths of 8, 12, 16, and 24 mm, and are compatible with the feeders for SMD components. Up to 42 die feeders can be installed on the Micron 2.
Specs 200/220/240/400 VAC; 3-Ph; 3500 VA; 50/60 Hz; 6.0 Bar
Features
  • Can handle boards, panels, flex substrates, boats with singulated substrates, and lead frames up to size 10″ x 14″
  • Wear-free air bearings, glass scales, granite base, and ceramic beams
  • 5 micron repeatibility
    12 micron placement
  • Angular resolution: 0.05 degrees
  • Minimum pitch: 0.1mm
    Throughput: varies with process (typical flip chip = 800-1200/hour)
    7-axis hot-bar assembly head with force sensing
Manufactured Year 2000
Quantity 2
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Camalot Vortex-X 3950

Posted on February 17, 2011 by admin
MSI ID 00178
Serial Number 3950-1100050-01
Manufacturer SpeedLine Technologies, Inc.
Model Vortex 3950
Equipment
Description		 The Speedline/Camalot 3950 Vortexx is designed around the Tessera Type IV BGA encapsulation process which is very similar to that of the Flip Chip encapsulation process. In the type IV BGA process, vacuum is applied to one side of the die while material is injected from the other side. This ensures a void free encapsulation or underfill of the BGA.
Specs Volts: 230; Max Amp: 10;
Hz: 50-60;
Air pressure: 80-100 psi / 5.5-6.9 bar
Manufactured Year 2000
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SimmPro-Atlas Automated Test, Label, and Sort System

Posted on February 5, 2011 by admin
MSI ID 00126
Serial 1156
Manufacturer SimmPro
Equipment Description SimmPro introduces the future of automated test handling and labeling! This cutting-edge design combines accuracy, reliability and cost-efficiency, not to mention the flexibility for future upgrades. A windows NT GUI integrates self-teaching, multiple test sites, fault-tolerance, labeling, bar code scanning and automated tray filling capabilities. It is specifically designed to interface with high-performance testers and provide rugged durability for 24/7 operating environments.
Features PC100  DDR RAMBUS Compatible
Accurate Multi-Site Configuration
Reliable Modular Pick & Place Design
Automated Tray Sorting and Packaging
Automated Labeling with 600 dpi Resolution
Ambient Environment Testing
Interfaces with ALL High-Performance Testers
Specs 120/208 V; 3delta 20A; 60 Hz; Air 6.9+-.07 bar (80+-PSI)
Quantity 1
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Mirae MR500

Posted on February 5, 2011 by admin
MSI ID 00125/00157
Serial 2000102A025
Manufacturer Mirae
Equipment Description Mirae MR5500 is a memory test handler for TSOP I, TSOP II, SOIC/SOJ, QFP/TQFP, LCC, PLCC, BGA, uBGA, BOC-fBGA, COB-fBGA device types. Mirae MR5500 has GPIB interface to couple with various testers such as Nextest Maverick GT (32 ~64para), Advantest T5377 (32 ~64para), Yokogawa AL6090 / 6095, Tanisys M500, Kingtiger tester etc. Mirae MR5500 is fully auto & manual operational with 64 sites max.
Features Minimized damage to devices by driving major parts with motors.
Easy to maintain.
All of types of packages are available.
Easy to replace a change kit.
Minimized scratch while picking.
High reliability of Socket Contacter.
Manages as file the teaching and configuration data as file.
Auto Retest functionality.
Hi-speed package handling.
High/Cold/Room Temp Test is available
Short Index Time.
Adapted Vertical Docking type to Test Site.
Software Mirae MR5500 runs 1.6.1 version of IRMS (Intelligent Real Monitoring System)
Specs 220VAC, 50/60 Hz
Quantity 2
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Aseco Corp. TL-50 IC Test Handler

Posted on February 5, 2011 by admin
MSI ID 00105
Serial Number 12808TL50H
Manufacturer Aseco Corporation
Model TL50
Equipment Description The TL-50 is a pick and place test handler, particularly suitable for handling fragile lead IC devices such as the popular QFP package. The TL-50 has a throughput capacity of 1,200 devices per hour and operates at temperatures ranging from -55 to +155 Celsius.
Specs AC 208; Voltage 240; Amp 30; Air Pressure 90 PSI
External Dimensions: 43″ x 54″ x 58″
Features Key features of the TL-50 include its simple design, which enhances uptime, and the ease with which it can be converted to handle different package types plus automatic tray loading and unloading.
Quantity 2
Status Not in Service; Condition Unknown
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