| FBGA
Memory Packaging |
FBGA is the new JEDEC-standard memory packaging solution
required for higher speed memory devices. These new
packages move the device connections from metal leads
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more) |
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| Assembly
Services |
Since
1984, Macrotron has been providing assembly of complex
PCB and memory modules. Macrotron's capabilities include:
supporting 24 hour consignment business, long term
turnkey, and consignment contracts.
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